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Plate to Liquid

It is used to cool or heat either objects attached directly to the coldplate, or enclosures by attaching a thermal conductive container tothe cold plate. Heat is dissipated to a liquid on the warm side. Theliquid circuit is normally of a circulating type with a pump and aLiquid-to-Air heat exchanger removing the heat into the ambient air.By using an efficient heat exchanger and one or more Plate to LiquidAssemblies a very powerful yet compact system is created. Ourstandard assemblies are optimized for high cooling capacity andefficiency rather than maximum AT Typical applications includetemperature cycling of electronic components, laser cooling andanalytical instruments.

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Our diverse range of thermal management solutions represents a commitment to excellence, precision, and reliability in the field of thermal control technology. With our expert team, we provides customized services to our clients to cater to a variety of industrial application. The Huajing thermal control systems are divided into different series: air to air, plate to air, liquid to air, thermoelectric machines.

Our plate-to-liquid thermal management solutions enable seamless heat transfer from high-heat surfaces to the fluid medium within the liquid cooling system, ensuring optimal temperature regulation for critical components in various applications including medical diagnostics, laser technology, and analytical instruments.

What is Thermal Management?

Thermal management systems refer to the tools and technologies designed to maintain the temperature of devices or systems within specific operational limits, with the aim of preventing overheating, ensuring efficient performance, and extending the lifespan of heat-generating devices. As a leading thermal management manufacturer, Huajing provides clients with 3D structure design and CAE thermal analysis to find a perfect solution.

  • Plate to Liquid

    Plate to Liquid Series

    It is used to cool or heat either objects attached directly to the coldplate, or enclosures by attaching a thermal conductive container tothe cold plate. Heat is dissipated to a liquid on the warm side. Theliquid circuit is normally of a circulating type with a pump and aLiquid-to-Air heat exchanger removing the heat into the ambient air.By using an efficient heat exchanger and one or more Plate to LiquidAssemblies a very powerful yet compact system is created. Ourstandard assemblies are optimized for high cooling capacity andefficiency rather than maximum AT Typical applications includetemperature cycling of electronic components, laser cooling andanalytical instruments.

If you want to know the value our products can generate, please feel free to contact us.

If you want to know the value our products can generate, please feel free to contact us.

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