Plate to Air
It is used in three key applications, including cooling or heating: 1) Objects directly on the cold plate, or objects on an additional cold plate of your own design; 2) Enclosures by attaching a thermal conductive container to the cold plate; 3) Liquids by attaching a thermal conductive tank or liquid heat sink to the cold plate. The heat is absorbed by the cold plate, pumped through the TE modules and then dissipated to the air by an air heat sink. It delivers compact and reliable cooling. Typical applications include cooling electrical devices, analytical instruments, lasers and commercial refrigeration.
The thermoelectric Cooler Assembly of this product provides cooling and heat dissipation by directly contacting the cold plate with the cooling object, while the heat is carried away through forced air cooling at the hot end. It is widely used in communication power cabinets, medical equipment, and laser devices. It features a compact design, small size, and high reliability.
■Economical general use thermoelectric cooler (high performance and quality but economical)
■Thermoelectric Cooler(TEC: Peltier module) with high ΔTmax, large heat absorption, and high efficiency
■Special original products, such as one with a center hole
■Long life time with break-proof structure
■Production for custom made Thermoelectric Coolers to meet our customers purposes is possible
By adopting semiconductor cooling technology, the product's cooling efficiency has been greatly improved.
Our thermoelectric cooler assemblies feature excellent sealing performance to prevent air leakage, ensuring reliable and stable operation in various environments.
The modular design of our thermoelectric cooler assemblies provides flexibility for customization and easy maintenance, allowing for quick and efficient replacement of parts if needed.
With a compact structure, our thermoelectric cooler assemblies are space-saving and easy to integrate into different systems or devices, providing efficient temperature control in limited spaces.
Huajing's semiconductor cooling technology can be applied to medical equipment such as IVD, bioanalyzers, PCR, MRI machines, CT scanners, and X-ray machines to reduce the heat generated by the equipment, maintain stable temperature control, and ensure the accuracy and reliability of equipment operation.
Laser equipment generates high heat during operation, which can damage the equipment and affect its performance. Huajing's thermal management solutions can effectively dissipate the heat generated by laser equipment, maintain stable working temperature, and improve its performance.
Stable operation of communication equipment is essential for high-speed data transmission in 5G communication. Huajing's thermal management solutions can effectively dissipate the heat generated by communication equipment, ensuring its stability and reliability.
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