Peltier Module Application #1: CPU and GPU Cooling Systems

Release time: July 30, 2025

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Peltier Module Application #1: CPU and GPU Cooling Systems

Peltier Module Application #1: CPU and GPU Cooling Systems


As computing power increases in embedded systems, edge devices, and AI workstations, managing heat becomes more critical than ever. While traditional air cooling and liquid cooling systems dominate the consumer PC market, Peltier modules (TECs) offer strategic advantages in specialized B2B CPU and GPU cooling applications.


## Why Use Peltier Coolers for CPUs/GPUs?
- Sub-Ambient Cooling
- Precision Control
- No Fluid Risk
- Compact Integration

## Target Applications

SectorUse Case
Medical ImagingEmbedded GPU cooling
Industrial AIEdge inference devices
Avionics & DefenseRugged board cooling in UAVs/satellites
Lab PCs Overclocked CPUs for real-time sims


## Design Considerations
- Use bi-directional drivers
- Implement heat sink or liquid loop
- Monitor power draw

## Example Setup
- Cold plate to CPU die
- Multi-stage TEC
- Heat sink + fan
- Thermistor feedback

## Partner With Huajing for TEC-Based Cooling Systems
We design complete solutions with:
- Optimized TECs for your chip wattage
- Thermal simulation + planning
- Ready-to-mount modules

Contact us: sale02@hj-tc.com

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